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On June 23, 2003, Associate Professor Patrick McCluskey hosted a multi-university Workshop on Power Device Packaging Reliability at the University of Maryland. The workshop was sponsored by the Office of Naval Research to review the latest research work in the area of solder, substrate, and interconnect mechanics applied to power electronics. The Mechanical Engineering Department was chosen to host the event because of its leading role in the mechanical design of reliable power electronic systems. Topics discussed included testing for power cycling reliability, enhancing solder reliability through optimized package design, new solder materials and soldering processes, novel power package structures, cooling techniques, and the effect of thermal management on package reliability. Speakers included Dr. Fritz Kub (NRL), Dr. Cemal Basaran (SUNY Buffalo), Dr. Vic Temple (Silicon Power Corporation), and Dr. McCluskey.
June 23, 2003
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