Associate Professor of Mechanical Engineering Bongtae Han has been appointed as an Associate Editor of ASME Transactions, Journal of Electronic Packaging for a three year term. Han was previously an Associate Editor of an international journal, "Experimental Mechanics" from 1999 to 2002.

Professor Han's research interests include mechanical design of microelectronics devices for optimum reliability; thermo-mechanical deformation analyses of electronic packaging subassemblies; experimental micromechanics; optical methods for displacement measurement.

July 15, 2004

«Previous Story  



Current Headlines

Revolutionizing Water Access: Aquair Wins 2023 R&D 100 Award

UMD Hosts Industrial AI Forum

Diving Deeper into Competition, and Recruitment

“The Legend of Zelda” Inspires New UMD Engineering Course

Sandborn Receives Scott Clements Award

Celebrating Native and Indigenous Voices in Engineering

We Build the Future Here: Stanley R. Zupnik Hall

Clark School Students Selected for Philip Merrill Scholarships

Funding Renewed for Research on Ventilator Alternative

Alumnus Receives National Medal of Technology and Innovation

Back to top  
AML Home Clark School Home UMD Home ENME Home