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Associate Professor of Mechanical Engineering Bongtae Han has been appointed as an Associate Editor of ASME Transactions, Journal of Electronic Packaging for a three year term. Han was previously an Associate Editor of an international journal, "Experimental Mechanics" from 1999 to 2002.

Professor Han's research interests include mechanical design of microelectronics devices for optimum reliability; thermo-mechanical deformation analyses of electronic packaging subassemblies; experimental micromechanics; optical methods for displacement measurement.



July 15, 2004


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