search

UMD    AML






Distinguished University Professor Avram Bar-Cohen and alumnus Dr. Peng Wang’s research paper on managing hot spots on microprocessor chips has been a hot topic at ASME’s Journal of Heat Transfer.  Their research paper, "Thermal Management of On-Chip Hot Spots" was among the top 10 downloaded articles in April and May 2012.  The paper debuted at seventh on the list in April, and rose to fourth in May. 

The research paper relies heavily on Wang’s 2007 dissertation at the University of Maryland and ongoing research at the Thermal Packaging of Electronic and Photonic Systems Laboratory (TherPES Lab) about on-chip thermoelectric cooling to reduce on-chip hot spots.  Wang has been the assistant research scientist at the lab since 2009 and has worked with several graduate students throughout the years.  Bar-Cohen, director of TherPES Lab, and Wang have collaborated with companies such as Intel, ITRI, Thermion, Hi-Z Technology, and Nextreme Thermal Solution and are developing novel cooling solutions for thermal management of hot spots on high-performance microprocessors and amplifiers. According to Wang, "On-chip hot spots generate heat fluxes that are several times higher than the chip average, thus producing high local temperatures that can dramatically degrade microprocessor performance and system reliability. For this reason, the development and application of new and novel local cooling techniques has become one of the most significant factors in the design of high-performance electronic systems.."

“This ‘popularity’ brings well deserved attention to the individual graduate students who have passed through TherPES Lab and the quality of their work,” Bar-Cohen said.  Wang said that their paper’s popularity also reflects “that our hot spot cooling concepts and recent research results have attracted considerable interests” in the heat transfer community. 

For more information about Professor Bar-Cohen’s research visit his faculty profile page.

 



Related Articles:
Bar-Cohen Named President of IEEE Electronic Packaging Society
Bar-Cohen Featured in Applied Mechanics Reviews Podcast
Bar-Cohen Receives 2014 IEEE Components, Packaging and Manufacturing Technology Field Award
Bar-Cohen to Receive ASME 75th Anniversary Medal
Srivastava & Bar-Cohen Deliver Tutorial at SEMI-THERM29

June 21, 2012


«Previous Story  

 

 

"This ‘popularity’ brings well deserved attention to the individual graduate students who have passed through TherPES Lab and the quality of their work.”

Dr. Avram Bar-Cohen

Current Headlines

Ashwani Gupta Named Royal Academy of Engineering Fellow

Maryland Engineering Ranks Among the Nation’s Top 20 Undergraduate Engineering Programs

UMD’s Gabriel Models Liberalized Energy Markets in Brazil

Graham Appointed to Navy Science and Technology Board

Yu Named Elkins Professor

Miao Yu to develop cost-effective sensor for measuring lake health

Dutt is PI on NSF-Funded Quantum Research Grant

Miao Yu receives NSF funding to develop ice-measuring sensors

Miao Yu selected as Wilson H. Elkins Professor

Center for Risk and Reliability Fosters Collaborative Environment

 
 
Back to top  
AML Home Clark School Home UMD Home ENME Home