Prof. Abhijit Dasgupta, CALCE faculty member, was honored with the InterPACK Achievement Award by ASME at The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), held in Anaheim, CA, Oct. 7–9, 2019. Prof. Dasgupta received the award for his research in electronic packaging and for his service to the electronics packaging community in ASME. At the Awards luncheon, he presented CALCE’s research roadmap, in a talk titled “Developing Reliable Microsystems in the Era of Heterogeneous Integration.”
InterPACK is the flagship conference of the Electronics and Photonics Packaging Division (EPPD), in technical co-operation with the Japanese Society of Mechanical Engineering (JSME).
His talk at the conference began with a discussion of the current state of the art in multiscale, multiphysics, and big-data approaches for developing highly reliable microsystems. He emphasized the need for identifying technology gaps and for timely development of complex next-generation heterogeneous integration (HI) systems. He discussed critical shortfalls in the current approaches and then presented potential roadmaps for new break-through approaches.
Prof. Dasgupta is Jeong H. Kim Professor of Mechanical Engineering at the University of Maryland (UMD), with research experience in the microscale and nanoscale mechanics and reliability physics of engineered materials used in conventional and additively manufactured 3D electronics and intelligent microsystems. He holds a Ph.D. in Theoretical and Applied Mechanics from the University of Illinois at Urbana-Champaign (UIUC), and has been a principal investigator at the Center for Advanced Life Cycle Engineering (CALCE) at UMD for the past 30 years, conducting research in reliability physics, design for reliability, accelerated stress testing, and real-time health management. He has published over 300 articles and conference papers; served on editorial boards of two international archival journals; presented over 40 workshops and short courses; helped form research and educational roadmaps for the electronics industry; and provided consulting services to numerous industry leaders. He has presented multiple keynote talks at international conferences, received 6 best-paper awards and received 8 major awards in recognition of his research and educational contributions. He is an ASME Fellow, past Chair of the ASME Electronic and Photonic Packaging Division (EPPD), current member of the ASME Design, Manufacturing and Materials Segment Leadership Team (DMM-SLT) and Reliability Topic Lead in the multi-society Heterogeneous Integration Roadmap (HIR) Team.
For more information on Prof. Abhijit Dasgupta, visit his faculty webpage.
October 18, 2019