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Department of Mechanical Engineering George E. Dieter Professor Michael Pecht has been awarded the 2016 Institute for Electrical and Electronics Engineers (IEEE) Components, Packaging and Manufacturing Technology Award.
The award recognizes meritorious contributions to the advancement of components, electronic packaging or manufacturing technologies, and Pecht was cited for his visionary leadership in the development of physics-of-failure-based and prognostics-based approaches to electronic packaging reliability.
Pecht is the founder and Director of the University of Maryland's Center for Advanced Life Cycle Engineering (CALCE). He holds a M.S. in Electrical Engineering, and a M.S. and Ph.D. in Engineering Mechanics from the University of Wisconsin at Madison. He is a Professional Engineer, an IEEE Fellow, an American Society of Mechanical Engineers (ASME) Fellow, a Society of Automotive Engineers (SAE) Fellow and an International Microelectronics Assembly and Packaging Society (IMAPS) Fellow.
He has previously received the European Micro and Nano-Reliability Award for outstanding contributions to reliability research, the 3M Research Award for electronics packaging and the IMAPS William D. Ashman Memorial Achievement Award for his contributions in electronics reliability analysis. Most recently, he was recognized by the Chinese Academy of Sciences (CAS) President’s International Fellowship Initiative with a Distinguished Scientist of 2015 Award.
He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum. He is chief editor for Microelectronics Reliability and an associate editor for the IEEE Transactions on Components and Packaging Technology.
Pecht’s research interests include competitive product development, product characterization and qualification, supply chain creation and management, prognostics and health management and product reliability, risk assessment and mitigation.
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July 2, 2015
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