Mechanical Engineering Ph.D. student Abhishek Deshpande has been awarded the Institute of Electrical and Electronics Engineers (IEEE) Electronics Packaging Society’s (EPS) Ph.D. Fellowship.
The EPS Fellowship is open to all members of IEEE EPS currently pursuing a doctoral degree within the field, but only one fellowship is awarded annually to a student who demonstrates significant ability to perform independent research in the fields of electronic packaging and has a proven history of academic excellence.
Deshpande is advised by Professor Abhijit Dasgupta and works in the University of Maryland’s (UMD) Center for Advanced Life Cycle Engineering (CALCE). His research focuses on the effect of multiaxial stress states and interfacial roughness on mechanical fatigue degradation of solder joints in functional electronics, using a combination of microscale mechanical testing and grain-scale finite element analysis.
In addition, Deshpande has been involved in various other research projects such as vibration and temperature cycling accelerated reliability testing of microelectronics assemblies at both CALCE and at Google, where he completed a summer internship.
The IEEE EPS Fellowships promote, recognize and support Ph.D.-level study within the field and include a cash award applicable towards the student’s research and a plaque of appreciation.
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